Despite impressive advances being made in the past decades, there are still genuine technical challenges in the thermal administration of electronic devices or microprocessors. The performance and reliability of those devices and components will benefit from better heat dissipation conditions. A novel Fibonacci phyllotaxis configuration of circular micro pin fin heat sinks for an integrated circuit having a footprint of 3.464mm*3.464mm has been developed to improve the heat dissipation performance. A comprehensive steadystate conjugate heat transfer analysis with three dimensions was carried out. A uniform heat flux of 5MW m 2 ⁄ was applied at the top surface of the electronic chip. To minimize both the maximum temperature of the chip and the required pumping power a multiobjective optimization technique was implemented. The effect of design parameters such as phyllotaxis coefficient, pin fin diameter, and pin fin height on response parameters was numerically investigated using the full factorial design of the experiment. ANN was coupled with MO-Jaya, to arrive at a Pareto frontier of the optimal compromise solutions. The optimal set of design variables was found as a height of 300μm, a diameter of 122.6 μm, and a phyllotaxis coefficient of 130 μm with an inlet velocity of coolant 2.263m/s. The selected optimum design is then investigated numerically, and the outcomes are compared to those predicted by the MO-Jaya algorithm. Since the optimization is with an acceptable level of correctness with a minimum percentage error. The final confirmed response variables were a maximum temperature of 51.6 ℃ and a pumping power of 0.191Watts. The results show that the Fibonacci phyllotaxis structure of the micro pin fin heat sink has better heat-dissipating performance. Keywords: Algorithm, Multi Objective-Jaya, Fibonacci, phyllotaxis, Pareto Frontier.